Aluminium nitride / AlN
Material Description: High thermal conductivity (>170W/(m-°C)), high corrosion resistance, high temperature resistance, low coefficient of expansion (4~5 μm/(m·°C)) and low density (>3.30g/cm3) characteristics of ceramic materials. Main applications: heat dissipation components, chip package substrates, etc.
Composition:
|
Y2O3 |
AlN |
|
4±1 |
Bal. |
Physical properties:
|
Properties |
Unit |
氮化鋁AlN |
|
Density ρ |
g/cm3 |
>3.30 |
|
Bending strength |
MPa |
300 |
|
Thermal conductivity |
W/(m*K) |
200 |
|
Coefficient of thermal expansion(CTE) |
25~200℃ μm/(m·℃) |
4.8 |
Micrograph (×1500)
