Pure Copper
Material introduction: Pure copper material is produced by MIM process. Combining the advantages of complex shape processing of MIM process and the advantages of high thermal conductivity and high electrical conductivity of pure copper material. Suitable for parts with high thermal conductivity and electrical conductivity requirements, but not high strength requirements.
Element composition:
|
C |
Cu |
|
≤0.03 |
≥99 |
Physical properties:
|
Properties |
Unit |
純銅 |
|
Density ρ |
g/cm3 |
>8.5 |
|
Hardness |
Hv |
80 |
|
Tensile strength Rm |
MPa |
50 |
|
Yield strength Rp0.2 |
MPa |
180 |
|
Elongation A10 |
% |
50% |
|
Thermal conductivity |
W/(m·℃) |
270 |
Metallography (×200)
